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項目Item
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制作能力Manufacure Capability
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層數
Layers
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2-16L
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板材類型
Material Types
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FR-4, 高TG，無鹵素 (FR-4, High TG，Halogen Free) |
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最大尺寸
Max.Panel Dimension
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546mm*622mm
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外形尺寸公差
Outline Tolerance
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±0.10mm
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板厚范圍
Board Thickness
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0.40mm-3.20mm
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板厚公差
Board thickness Tolerance(t=0.8mm)
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±8%
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最小線寬
Min.track Width
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0.075mm
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最小線距
Min.track Width
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0.075mm
|
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外層銅厚
External Cu.Thickness
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35um-140um
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內層銅厚
Internal Cu.Thickness
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17um-140um
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鉆孔孔徑(機械鉆)
Drilling Bit Size(CNC)
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0.20mm-6.0mm
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成孔孔徑(機械鉆)
Finished Hole Dimension(CNC)
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0.10mm-5.95mm
|
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孔徑公差(機械鉆)
Hole Tolerance(CNC)
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±0.075mm/±0.05mm
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孔位公差(機械鉆)
Hole Postion Tolerance(CNC) |
±0.05mm |
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鉆孔孔徑(激光鉆)
Laser Drilling Hole Size
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0.1mm-6.0mm
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板厚孔徑比
Board Thickness Min.Hole Dimension
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8:1
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阻焊類型
Solder Mask
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感光油墨(綠/紅/黃/黑/紫/白/蘭/啞綠/啞黑等顏色)
LPI Solder Resistink(Green,Red,Yellow,Black,Purple,White,Matt Green,Matt Black etc.)
|
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最小阻焊橋寬
Min Solder Mask Bridge
|
0.0635mm
|
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阻抗公差
Impedance Control Tolerance
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±10% |
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脹縮公差
Expansion & Shrinkage Tolerance
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+0.0254mm |
表面處理類型
Surface Finishing |
無鉛噴錫 化學鎳金 化學錫 化學銀 抗氧化
(HAL LF, ENIG, Immersion Tin, Immersion Silver, OSP) |
